Fuel Data-Centric Innovation with High-Bandwidth and Low Power External Memory Interface
Achieve breathtaking performance for high-end and midrange applications with the first FPGA family to feature the newest, cutting-edge, energy-efficient memory solutions with bandwidth speeds up to 1Tb/s1.
- The HBM2e standard, supported in Intel Agilex 7 devices, is compliant with the latest JEDEC JESD235C standard vs. JESD235A with Intel Stratix 10.
- Intel Agilex 7 FPGA M-Series achieves the maximum bandwidth of 410 GB/s per stack and Intel® Stratix® 10 devices achieve 256GB/s per stack.
- Intel Agilex 7 FPGA M-Series HBM2e stack contains 4 to 8 layers and each layer’s die capacity is 2GB providing a max density of 16GB/stack.
- Intel® Stratix® 10 devices also contain 4 to 8 layers and each layer’s die capacity is 1GB providing a max density of 8GB per stack.