Delivering Quality Leadership
Intel's mission is to delight our customers, employees, and shareholders by relentlessly delivering the platform and technology advancements that become essential to the way we work and live.
The Secret of Our Quality Promise
See how knowledge-based qualification helps Intel deliver fast, reliable, and efficient products while maintaining the highest quality.
Your Trusted Reliability Advisor
Using knowledge-based qualification or standards-based methodology to qualify products in unique usage environments, we deliver quality and reliability throughout our diverse product portfolio.
Intel Quality System Handbook
The handbook describes how our management system maintains quality throughout technology development, product development, materials quality, manufacturing, and customer support. Achieving and maintaining world-class quality leadership are top priorities, resulting in a culture that keeps us at the forefront of the semiconductor industry.
Quality and Reliability at a Glance
See our quality processes, policies, and procedures in action.
Customer Quality Support
A critical role as a liaison between Intel and our customers, customer quality support ensures mutually beneficial results for both parties.
All of Intel's mature manufacturing Wafer Fabrication sites, Assembly/Test sites, and Logistics centers are registered to ISO 9001:2008 by a third-party registrar.
Low Temperature Solder (LTS) “Greener” Manufacturing Process
A breakthrough technology has enabled the advancement of Low Temperature Solder (LTS) that meets process and reliability requirements. LTS provides production cost savings, environmental benefits and enables faster technology scaling for printed-circuit board assemblies in electronics industry electronic assemblies.
Quality Manufacturing Videos
Electrostatic Discharge (ESD) Prevention Methods
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Ball Grid Array Rework: Package-on-Package Devices
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation..