Produktsortiment
I/O-Optionen
Status
Discontinued
Einführungsdatum
Q3'17
Voraussichtliche Produkteinstellung
Q4'20
EOL-Ankündigung
Tuesday, August 25, 2020
Letzte Bestellung
Sunday, November 1, 2020
Letzte Empfangsattribute
Friday, January 1, 2021
Enthaltene Komponenten
Allows external access to the Host Fabric Interface (HFI) on supported processors. The connection to the external access is done through two QSFP+28 style connections.
The fabric carrier is designed to be mounted at the OCP Mezz location found on the baseboard/chassis. There is no connection to the motherboard OCP connector. All required signals/power for the board are passed through the sideband cable.
Kit includes:
(1) IFT Carrier Board Mezz
(1) 235mm, 1 port, straight IFP28 connector to LEC54B right angle – right exit connector (Mezzanine card to Fabric Processor #1)
(1) 430mm, 2x12 HFI Sideband Y Cable, Single Omni-Path Sideband IFT Carrier to dual Omni-Path CPU connectors (Mezzanine card to server board CPU HFI Sideband connectors)
(2) Fabric Processor Clips
(4) Mounting Screws

Additional Required Accessory:
Dual processor configurations requires the addition of cable kit AXXCBL370IFPS1 (Mezzanine card to Fabric Processor #2)
Ablaufdatum für die Verfügbarkeit für neue Designs
Monday, July 11, 2022

Zusätzliche Informationen

Beschreibung
Accessory IFT Fab Carrier Mezzanine kit to support Xeon Fabric processor. Includes 1 sideband cable and 1 IFP cable.