® Intel I/O Controller Hub 9 (ICH9) Family

Thermal and Mechanical Design Guidelines ® — For the Intel I/O Controller Hub 9 (ICH9) Desktop Family June 2007 Document Number: 316974-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Intel is not obligated to provide any support, installation or other assistance with regard to the information or products made in accordance with it. ® The Intel I/O Controller Hub 9 (ICH9) may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel, Pentium, Intel Core, Intel Inside, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2007 Intel Corporation. All rights reserved. 2 Thermal Design Guidelines Contents 1 2 3 4 5 Appendix A Appendix B Introduction.....................................................................................................7 1.1 Terminology ..........................................................................................8 1.2 Reference Documents .............................................................................8 Product Specifications........................................................................................9 2.1 Package Description................................................................................9 2.2 Package Loading Specifications.................................................................9 2.3 Thermal and Power Specifications.............................................................9 2.4 T Limit.......................................................................................11 CONTROL Thermal Metrology ..........................................................................................13 3.1 Case Temperature Measurements ...........................................................13 3.2 0° Angle Thermocouple Attach Methodology.............................................13 3.3 Ambient Temperature and Airflow Measurement .......................................14 ATX Reference Thermal Solution .......................................................................17 4.1 Environmental Reliability Requirements ...................................................18 4.2 ATX boundary conditions .......................................................................18 Balanced Technology Extended (BTX) Thermal Solution Guidance ..........................21 Currently Enabled Suppliers..............................................................................23 Mechanical Drawings .......................................................................................25 Thermal Design Guidelines 3 Figures Figure 1. 0° Angle Attach Methodology (top view, not to scale) .............................14 Figure 2. 0° Angle Attach Heatsink Modifications (generic heatsink shown, not to scale)......................................................................................................14 Figure 3. Recommended Temperature Measurement Placement: Top View ..............15 Figure 4. Recommended Airflow and Temperature Placement: Side View ................15 Figure 8. ATX Boundary Conditions ...................................................................19 ® Figure 9. Intel ICH9 Component Package Drawing .............................................26 Figure 10. Motherboard Keep-Out for Reference Heatsink .....................................27 Figure 11. Reference Heatsink Extrusion.............................................................28 Figure 12. Reference Heatsink Clip ....................................................................29 Figure 13. Reference Heatsink Assembly ............................................................30 Tables Table 1. Package Loading Specifications..............................................................9 ® Table 2. Intel ICH9 Thermal Configurations and Power Specifications ..................10 Table 5. Reference Thermal Solution Environmental Reliability Requirements .........18 Table 6. Projected Chassis Conditions by Case for BTX Form Factor ......................21 ® Table 7. Enabled Suppliers for the Intel ICH6, ICH7, ICH8 & ICH9 Reference Heatsink..................................................................................................23 4 Thermal Design Guidelines Revision History Rev. No. -001 • Initial Release. Description §