Recently named one of the top 50 most creative people in Business (Fast Company,) Genevieve Bell is an Intel Fellow and director... (4:52)
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Intel IT’s approach to PC refresh and Ultrabook™ deployment
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Mandarin: Guide to LGA115X socket independent loading mechanism installation.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Compares cost of buying one Ultrabook™ device to both laptops and tablets for each employee. (3:07)