Demonstration of concept to bring the endcap to life using Intel embedded technology.
With SAP HANA* and Intel you get purpose-built integration that accelerates and simplifies your business.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.