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Intel® Itanium® Processor Technical Resources

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Boundary Scan Description Language (BSDL) Model

Intel® Itanium® Processor 9300 Series BSDL
Intel® Itanium® Processor 9100 Series BSDL
Intel® Itanium® Processor 9000 Series BSDL

List of Validated DIMMs

Intel® Itanium® Processor 9300 Series DDR3 DIMM System-level Validation Results

Packaging Information

Chapter 01: Introduction
Chapter 02: Package/Module/PC Card Outlines and Dimensions
Chapter 03: Alumina and Leaded Molded Technology
Chapter 04: Performance Characteristics of IC Packages
Chapter 05: Physical Constants of IC Package Materials
Chapter 06: ESD/EOS
Chapter 07: Leaded Surface Mount Technology (SMT)
Chapter 08: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs
Chapter 09: SMT Board Assembly Process Recommendations
Chapter 10: Shipping and Transport Media
Chapter 11: International Packaging Specifications
Chapter 12: Tape Carrier Package
Chapter 13: Pinned Packaging
Chapter 14: Ball Grid Array (BGA) Packaging
Chapter 15: The Chip Scale Package (CSP)
Chapter 16: Cartridge Packaging
Chapter 17: Material Content of IC Packaging

Software Documents

Intel® Itanium® Processor Family Error Handling Guide
Itanium® Software Conventions and Runtime Architecture Guide
Intel® Itanium® Processor Family System Abstraction Layer Specification

Technical Books

Itanium® Architecture for Software Developers
Programming Itanium®-based Systems
Scientific Computing on Itanium®-based Systems

Thermal Mechanical Design Guides

Intel® Itanium® Processor 9300 Series Enabling Components Supplier Listing

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