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Report Problems: Contact Us

Complete this form with questions or feedback, and an Intel representative will promptly research and respond directly by e-mail.

Electrostatic Discharge and Electrical Overstress: Guide

Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

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Shipping, Transport Media, and Moisture Sensitivity Level: Guide

The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

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Intel International BV ISO 9001:2008 Certificate

Certifies that Intel International BV complies with ISO 9001:2008 requirements for the distribution and storage of finished goods for the EMEA region.

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Quality and Reliability: Intel Quality System Handbook

Quality and reliability overview summarizes the Intel Quality System Handbook, describing Intel’s quality policy, quality management system, and more.

Intel® LGA13XX Socket: System Integration Factory

Shows processor insertion into the Intel® LGA13XX Series socket independent loading mechanism to minimize handling damages to socket contacts.

Intel® LGA2011 Socket in Board Factory: Mandarin

Shows proper installation of LGA2011 socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

Intel® LGA2011 Socket in System Factory: Mandarin

Shows processor insertion into the LGA2011 socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

Land Grid Array Socket and Package Technology

Process for the handling, inspection, and integration of land grid array socket and package technology.

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Product Functional Analysis Capabilities

Intel’s quality management system uses seven capabilities in product functional analysis, providing timely root cause info; includes lab location map.