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Intel® Communications Chipset 89xx Series: Design Guide

Design Guide: Thermal and mechanical design specifications for the Intel® Communications Chipset 89xx Series. (v.001, Oct. 2012)

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Intel® Xeon® Processor E5-2600 v2 Series: Power Guidelines

Guidelines: Provides power data for the Intel® Xeon® processor E5-2600 v2 series while running real-life applications. (v.1, Aug. 2013)

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Intel® Atom™ Processor 200 Series: Thermal/Mechanical Design Guide

Thermal and Mechanical Design Guide: Intel® Atom™ processor 200 series.

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Intel® Xeon® Processor i3-2115 C: Power Guideline Addendum

Power Guideline Addendum: Provides power numbers on the Intel® Xeon® processor i3-2115 C while running real life applications. (v.001, Aug. 2012)

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Intel® Communications Chipset 8920: Power Guide Addendum

Addendum: Provides power consumption information on the Intel® Communications Chipset 8920 while it is running on industry standard applications.

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Embedded Intel® Architecture: Board Bring Up Procedure

White Paper: Explains motherboard stability tests and debug methods to solve issues during embedded Intel® architecture-based board bring up.

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PCB Stack-up Overview for Intel® Architecture Platforms

White Paper: PCB stack-up designs for Intel® Architecture platforms meet high-speed needs, addressing challenges with speed and costs. (Dec. 2008)

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Basics of Building Intel® Architecture Design

White Paper: Describes elements of Intel® architecture design, including voltage regulators, clock sources, and power sequencing. (v.1, Sept. 2010)

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Multi-Core Processor Performance Optimization

Sarma Vrudhula of Arizona State University presents research on multi-core processor performance optimization under thermal constraints.

Optimization of Multi-Core Processors Under Thermal Constraints

Presentation: Describes performance optimization for multi-core processors under thermal constraints at Intel® Embedded Education Summit 2010.

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