Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.
Chapter 1 Introduction: An overview of package families, including package attributes, package types, and a package selection guide.
Packaging Databook, Ch. 11: international packing specifications with rules and standards.
Chapter 11 International Packaging Specifications: A listing of international packaging specifications and a comprehensive resource library.
Server mit Intel® Xeon® E7-Prozessoren bieten Verwaltungs- und Sicherheitsfunktionen für unternehmenskritische Aufgaben.
The Intel® Xeon® processor E7 family-based server delivers mission-critical management and security capabilities.
Paper covers optimization for a 32nm SoC platform with 2nd Generation high-k/Metal gate transistors.
Discusses optimization for a 32nm high-k/metal gate transistor for system-on-chip (SoC) platform applications, offering transistor variability, interconnects, RF/analog passive elements, embedded memory, and noise mitigation options.
Presentation examines the impacts and benefits of RF CMOS technology scaling in high-k/Metal gate era for RF SoC (System-on-Chip) applications.
Presentation examines the impacts of silicon technology scaling trends and the associated technological innovations and benefits on RF CMOS.