This block diagram provides a description of the functions, capabilities, and connectivity within the Intel® platform shown. Based on Intel® microarchitecture (formerly Ivy Bridge) and manufactured on 22-nanometer process technology, these processors are designed for single-socket systems with options for two and four cores and a thermal design power (TDP) range of 15 watts to 40 watts. When paired with the Intel® Communications Chipset 89xx Series, this platform extends the scalability of Intel® architecture into smaller footprint communications applications and intelligent systems without sacrificing standard industry features such as workload acceleration, multi-core processing, and virtualization.
Explore Intel's past, present, and future embedded processors and chipsets.
Find optimum locations to place the chipset on the motherboard to reduce the risk of mechanical shock.
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