Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Mandarin: LGA2011 socket independent loading mechanism installation guide, minimizing contact damage.