PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Processor insertion guide for LGA1567 socket independent loading mechanism, minimizing contact damage.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.