Intel® 631xESB/632xESB I/O Controller Hub: Thermal Guide
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Measuring I/O Shield Alignment
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Package-on-Package Devices: Ball Grid Array Rework
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Electrostatic Discharge Prevention Methods
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Antenna and Oscilloscope: Electrostatic Discharge Detection
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Intel® LGA115X Socket: System Integration Factory
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Vishay Micro-Measurements Strain Gage
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Automaker GM Speeds IT for Success
GM leaders discuss rapid data sharing to bring vehicles to market faster and increase sales.
Intel® LGA115X Socket: Board Factory
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Intel® LGA115X Socket: Mandarin Board Factory
Mandarin: Guide to LGA115X socket independent loading mechanism installation.
Handling Recommendations: Manufacturing with Intel® Products
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Kyowa Strain Gage
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Corner Glue: Application Techniques and Materials
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Ball Grid Array Socket Rework: Motherboard Repair
Demos removing and replacing damaged ball grid array socket components for motherboard repair.